HIGH PERFORMANCE HEAT SINK COMPOUND - SP-420/0.3G
HIGH PERFORMANCE HEAT SINK COMPOUND - SP-420/0.3G
Thermal grease, also known as thermal paste or thermal compound, is a type of material used to enhance the transfer of heat between a computer’s central processing unit (CPU) and its cooler. The CPU generates a significant amount of heat when it is in operation, and if not dissipated efficiently, this can lead to overheating and damage to the computer’s components.
Thermal grease is applied between the surface of the CPU and the cooler to fill any gaps or irregularities that may exist between the two surfaces. It is designed to be highly conductive to heat, allowing it to transfer heat away from the CPU and into the cooler more effectively.
When applying thermal grease, it is important to use the correct amount to ensure optimal performance. Too much or too little thermal grease can negatively affect the transfer of heat, and can lead to higher temperatures and reduced CPU performance. Additionally, it is important to replace the thermal grease periodically to ensure that it continues to provide effective heat transfer.
Thermal grease is a crucial component in maintaining the temperature of a computer’s CPU, and ensuring optimal performance and longevity of the system. It is important to choose the right type of thermal grease for your specific application, and to apply it correctly to achieve the best results.
SPECIFICATIONS
Thermal Impedance: | <0.12CW |
Thermal Conductivity | >2.93W/m-K |
Colors | silver gray |
Dimensions Injection tube : | 55×8.5mm (wxd) |
G.W. Weight | 0.3 Gram |
Specific Gravity | >1.7 |
Bleed | <0.05% |
Dialectric Constant | >5.1(100Hz) |
Evaporation: | <0.001% |
Silicone Compounds | 50% |
Carbon Compounds | 30% |
Metal Oxide Compounds | 20% |
Application Thermal grease can be used on the rear side of the heatsink Certifications ROHS |
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temperature of heating resist instantaneous | -50~240℃ |
Operation Temperture | -30~180℃ |
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