HIGH PERFORMANCE HEAT SINK COMPOUND SP-700/0.5G
HIGH PERFORMANCE HEAT SINK COMPOUND SP-700/0.5G
SILVERGREASE High-Performance Heat Sink Compound
Enhance your cooling efficiency with SILVERGREASE, a premium thermal compound designed for optimal heat dissipation. This high-performance heat sink compound is ideal for use on the rear side of heatsinks, ensuring your components stay cool even under heavy loads.
Key Features:
- Wide Temperature Range: Resistant to temperatures from -50°C to 240°C, with an operational range of -30°C to 180°C, making it suitable for various demanding applications.
- Reliable Certifications: Compliant with CE and ROHS standards, guaranteeing both safety and environmental responsibility.
- Versatile Application: Perfect for improving the thermal conductivity between heatsinks and processors, GPUs, or other high-heat components.
Choose SILVERGREASE for superior thermal performance and long-lasting protection for your electronic devices.
FEATURES
Thermal Impedance:<0.12CWThermal Conductivity>2.93W/m-KColorssilver grayDimensions Injection tube :55 x 8.5mm (w x d)G.W. Weight0.5 GramSpecific Gravity>1.7Bleed<0.05%Dialectric Constant >5.1(100Hz)Evaporation:<0.001%Silicone Compounds50%Carbon Compounds30%Metal Oxide Compounds20%Application Thermal grease can be used on the rear side of the heatsink
Certifications ROHStemperature of heating resist instantaneous-50~240℃Operation Temperture-30~180℃
SPECIFICATIONS
Weight | 0,03 kg |
---|---|
EAN |
6943051200651 |
Brand |
Spire |
Unit Weight (kg) |
0,001 |
Unit Dimensions (cm) |
5.5×5,5×0.85 |
Package Weight (kg) |
0.03 |
Package Dimensions (cm) |
8×2.8×1.7 |
Thermal Impedance |
<0.12CW |
Thermal Conductivity |
>2.93W/m-K |
Certification |
CE/ROHS |
Color |
Silver Grey |
Specific Gravity |
>1.7 |
Bleed |
<0.05% |
Dielectric Constant |
>5.1 |
Warranty |
2 years |
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Premium Thermal Solutions
Trusted by Intel & AMD since 2001
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Spire Pininfarina collaboration in 2004
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Ergonomic Solutions
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